High efficiency molecular beam epitaxy wafer growth technology.
Proprietary technology to support operation across a range of operating temperatures
Multiple peak wavelength designs from 760nm to 1700nm
Molecular Beam Epitaxy enables Lasertel to precisely control the semiconductor laser properties and ensure that the desired operating wavelength is obtained with a high degree of accuracy.
Low Stress Wafer Process ensures that low “smile” bar assemblies are obtained and that stress does not adversely contribute to device reliability.
Advanced Technology for Laser Facet Protection (EMOF) enables the elimination of catastrophic optical mirror damage as a failure mechanism.
Hard soldered expansion matched materials enable operation across in harsh environments across a wide range of temperatures.
Precision micro-optics to provide collimation in both the fast and slow axes as well as custom beam shaping and homogenization.
Novel heatsink designs incorporated in fluid cooled CW arrays are designed to for operation with a range of fluid types.
Custom assemblies (sub-assemblies, assemblies and full turn-key systems) typically incorporate custom water or air cooled heatsinks, mechanical enclosures and custom electronic hardware and software.
Contact our team today for your custom laser diode needs.