- Hard Soldered Expansion Matched Materials: Lasertel uses high temperature solders that prevent joint fatigue failures and avoid whisker growth. In combination with the use of novel expansion matched materials, this enables the manufacture of assemblies that are extremely robust across wide operating temperature ranges.
- Micro-Optics: Lasertel can provide fiber-coupled and lensed array solutions incorporating precision micro optics to provide collimation in both the fast and slow axes.
- Novel Heatsink Designs: Lasertel manufactures water cooled CW arrays that incorporate novel heatsink designs to eliminate the problems associated with micro-channel coolers. The Lasertel approach requires only minimally filtered non-DI water and incorporates the hard solder technology found in all Lasertel assemblies.
- Custom Assemblies: Lasertel manufactures custom sub-assemblies, assemblies and full turn-key systems. These products typically incorporate custom water or air cooled heatsinks, mechanical enclosures and custom electronic hardware and software.
Contact our team today for your custom laser diode needs.